First Solid State Scanning Lidar
LiDAR stands for Light Detection And Ranging or Light imaging, Detection And Ranging. It emits laser pulse and detects the bounced back signal from objects. By extracting the distance and relative velocity to objects from the signal, and steering the beam to different directions, the 3D model of the environments is constructed, and represented by the data called "point cloud". LiDAR is divided into three types and they are listed below
Conventionally scanning LiDAR uses mechanical rotation to spin the sensor for 360 degree detection. LiDAR with mechanical rotation enables high speed scanning and is safer for eyes even with higher power laser as the light does not goes to only one direction.
Hybrid solid state LiDAR uses micro-electromechanical system (MEMS) technology in which a MEMS based mirror moves to “scan” the environment. The technology outpaces mechanical rotation in price and size but is short in long distance detection.
Solid state means the LiDAR doesn't contain any moving part. Correspondingly, soild state beam steering means the beam propagation direction is controlled without any moving parts,which include wavelength-tuning dispersion, optical-lens switch and optical phased array (OPA).
Wavelength-tuning dispersion is a true solid-state approach. However, due to the limitation of wavelength tuning range, this procedure is practically one-dimensional.
Opical-lens switch steers the beam by switching the emitting position of light on the focal plane of a lens. Similar to OPA, integration scale and optical loss matters in this technology.
Optical Phased Arrays (OPA) describes a control of the phase and amplitude of light propagating through. This shape is also a solid-state concept. Sidelobes, integration scale and optical power loss are the challenges in OPA technology.
FMCW stands for Frequency Modulated Continuous Wave. FMCW lidar sends out a constant stream of light (“continuous-wave”) and changes the frequency of that light at regular intervals (“frequency-modulated”). This allows us to both determine the location of objects and precisely measure their velocity using the Doppler effect.
DSP stands for Digital Signal Processing. With Digital Signal Processing, you can manipulate signals after they have been converted from analog voltages and currents into digital form -- i.e., as numbers. Normal analog operations of filtering, mixing, and signal detection all have their parallels in the DSP world. Because the cost of complex digital processing is very low, DSP is often the preferred way to build high-performance communications and sensing systems.
Silicon Photonics is a combination of two of the most important inventions in the 20th century—the silicon integrated circuit and the semiconductor laser and optical devices. It enables faster data transfer over longer distances compared to traditional electronics, while utilizing the efficiencies of high-volume silicon manufacturing. Thousands or even more optical devices are integrated compactly on a single chip.
As the eyes of machines, LiDAR plays the more vital role in many applications: autonomous driving(AD), robotics, logistics, sensing and mapping, and smart city, just name a few. Xight Lidar products have already been used in railway testing and will be used in security monitoring and autonomous vehicles.
Previous chairman assistant of 鲲游(North Ocean Optoelectronics); Ph.D of Optical Engineering in Zhejiang University (President of Student Union)
B.S of Optical Engineering in Zhejiang University (First science and engineer student graduated in three years when using credit system); M.S of EE in UCLA; Ph.d candidate of Stats in UCSB
Previous engineer of Sky Works; Ph.D of UC Davis
If you share our desire to build a work environment based on respect, healthy collaboration, focus on the team’s success, and you’re excited to work at the frontiers of technology, we want to hear from you.
1. Bachelor degree or above in electronics and communication; 2. Have the ability to independently design FPGA program architecture; 3. Master Verilog HDL and other hardware description languages, and be familiar with C programming language. 4. Be familiar with typical signal processing methods, be proficient in MATLAB and be able to simulate relevant algorithms.
1. Bachelor degree or above, major in electronic information, with PCB design experience;
2. Master PCB related design software, such as Altium designer, Cadence, Auto CAD, ADS, etc;
3. Proficient in digital and analog electrical related knowledge;
4. Good teamwork and strong self-learning ability.
1. Master of silicon photonics or above; 2. The number of chips is more than 2, and the total design chip area is greater than 1 square centimeter; 3. Be familiar with silicon light design and layout tools such as EDA under lumerical and synopsis; 4. Have a deep understanding of silicon optical devices, such as waveguide, MMI, SiGe PD, coupling, heat transfer, etc; 5. Have solid basic knowledge of signal processing, communication, etc.
1. Master of analog chip or above; 2. The number of tapeout is more than two, and the total design chip area is greater than 0.2 square centimetre; 3. Master vituoso and other design and layout tools; 4. Have a deep understanding of simulator components, such as mixer, active filter, ADC, etc; Participate in high-speed AD / DA design is an extra credit; 5. Have solid basic knowledge of signal processing, communication, etc.
1. Full time bachelor degree in computer, electronic information, communication specialty and other relevant majors, with at least one year of embedded working experience; 2. Master the performance, structure and development of STM32 series chips; 3. Master C, C + + and other languages, and have good programming habits; 4. Be familiar with the peripheral interface circuit of STM32 and the application of its associated hardware circuit, and be familiar with various communication protocols of DSP / MCU; 5. Have good working attitude and learning ability.
1. Bachelor degree or above, major in human resources; 2. At least one year working experience in human resources, working experience in semiconductor company is preferred; 3. Have good coordination ability and communication skills.
1. Design the overall product structure, parts, accessories and process drawings according to the project requirements; 2. Be responsible for supplier technical contact, mold opening review, molding process review and failure analysis review; 3. Be responsible for structural design, mechanical analysis and scheme optimization of optical fiber and lens; 4. Be familiar with the principle and use of various transmission, servo and detection mechanisms or components, and have good modeling ability;
Xight now has reached two rounds of tens of millions of financing with Lenovo, Silergy, Shanghai Industrial Research Institute and Zhejiang Youchuang. At the same time, Xight has completed the delivery of FMCW module with Zhejiang University, and completed the delivery of the whole machine with Qianfang and Tonghao.
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